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Special Training On BGA Machine


ball grid array (BGA) devices particularly require expertise and appropriate tools. A hot air gun or hot air station is used to heat devices and melt solder, and specialised tools are used to pick up and position often tiny components.


Reasons for rework of electronics include

• Poor solder joints due to faulty assembly or thermal cycling

• Solder bridges—unwanted drops of solder that connect points that should be isolated from each other.

• Faulty components.

• Engineering parts changes, upgrades, etc.

The rework may involve several components, which must be worked on one by one without damage to surrounding parts or the PCB itself Reflowing as a rework technique, similar to the manufacturing process of reflow soldering, involves dismantling the equipment to remove the faulty circuit board, pre-heating the whole board in an oven, heating the non-functioning component further to melt the solder, then cooling, following a carefully determined thermal profile, and reassembling, a process which is hoped will repair the bad connection without the need to remove and replace the component.

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